Taiwan, China, South Korea, and Japan continue to foster growth, while the rest of Asia competes for foreign investment and ...

A  new technical paper titled “Sustainable Hardware Specialization” was published by researchers at National University of ...

A new technical paper titled “Implementation of Negative Differential Resistance-Based Circuits in Multigate Ge Transistors” ...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased ...

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be ...

A new memory module architecture expands the capabilities of server main memory.

Layer Thin-Film Transistor Analysis and Design” was published by researchers at Oregon State University and Applied Materials ...

A hardware-software contract is needed for software portability, but RISC-V is not yet defined well enough to know what that ...

A new technical paper titled “MegaMmap: Blurring the Boundary Between Memory and Storage for Data-Intensive Workloads” was ...

Researchers from MIT and University of Udine fabricated a transistor that uses ultrathin layers of gallium antimonide and ...

proteanTecs AVS Pro has demonstrated the potential to extend chip lifespans by up to 18%. In data centers, this translates to ...

Parallel test is used for nearly every device produced by fabs and OSATs, but it can reduce yield and increase the cost of ...