Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

TSMC's Arizona Fab 21 began 4nm chip mass production in Q4 2024. Costs are higher than in Taiwan; 2nm production starts in ...

Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked ...

The U.S. and Europe’s push to re-shore semiconductor manufacturing highlights a critical gap in advanced packaging, which remains dominated by the Asia Pacific region. With over 500 OSAT providers and ...